Explore the latest in mobile technology, device launches, and advancements in smartphone software and hardware.
Xiaomi and Qualcomm have inked a 15-year partnership extension, ensuring Xiaomi's premium smartphones will lead with Snapdragon 8 series chips for years to come.
Discover MediaTek's Dimensity 9400 Plus, offering a 20% Gen AI boost and cutting-edge edge-AI capabilities for future flagship smartphones.
MediaTek's Dimensity 8400 redefines mid-range performance with its all big core design and robust NPU for enhanced AI capabilities.
Discover why the iPhone 17 is worth the wait, with insights into Apple's future-focused development and rumored groundbreaking features.
MediaTek's Dimensity 9400 SoC introduces 'agentic' AI, a groundbreaking technology that autonomously manages smartphone functions.
Huawei plans to unveil the world's first tri-folding smartphone on September 10, strategically timed to coincide with Apple's iPhone 16 event.
Following the success of the flagship Snapdragon 8 Gen 3, Qualcomm introduces a more streamlined version designed to drive premium flagships with a focus on on-device AI. This scaled-down iteration...