MediaTek's Dimensity 8400: Revolutionizing Mid-Range Chips with All Big CPU Cores
MediaTek's Dimensity 8400 redefines mid-range performance with its all big core design and robust NPU for enhanced AI capabilities.
12 Compelling Reasons to Anticipate the iPhone 17 Launch Next Year
Discover why the iPhone 17 is worth the wait, with insights into Apple's future-focused development and rumored groundbreaking features.
Unveiling 'Agentic' AI: The Revolutionary Feature of MediaTek's Dimensity 9400 Chip
MediaTek's Dimensity 9400 SoC introduces 'agentic' AI, a groundbreaking technology that autonomously manages smartphone functions.
Huawei Challenges Apple with World's First Tri-Folding Smartphone Launch
Huawei plans to unveil the world's first tri-folding smartphone on September 10, strategically timed to coincide with Apple's iPhone 16 event.
Qualcomm Unveils Scaled-Back Snapdragon 8s Gen 3 with Focus on On-Device AI
Following the success of the flagship Snapdragon 8 Gen 3, Qualcomm introduces a more streamlined version designed to drive premium flagships with a focus on on-device AI. This scaled-down iteration...