Huawei Challenges Apple with World's First Tri-Folding Smartphone Launch
Date: Sep 4, 2024
Category: Smartphones
Share on:
You may also like these similar articles
Qualcomm Unveils Scaled-Back Snapdragon 8s Gen 3 with Focus on On-Device AI
Following the success of the flagship Snapdragon 8 Gen 3, Qualcomm introduces a more streamlined version designed to drive premium flagships with a focus on on-device AI. This scaled-down iteration...
Unveiling 'Agentic' AI: The Revolutionary Feature of MediaTek's Dimensity 9400 Chip
MediaTek's Dimensity 9400 SoC introduces 'agentic' AI, a groundbreaking technology that autonomously manages smartphone functions.
12 Compelling Reasons to Anticipate the iPhone 17 Launch Next Year
Discover why the iPhone 17 is worth the wait, with insights into Apple's future-focused development and rumored groundbreaking features.
MediaTek's Dimensity 8400: Revolutionizing Mid-Range Chips with All Big CPU Cores
MediaTek's Dimensity 8400 redefines mid-range performance with its all big core design and robust NPU for enhanced AI capabilities.
MediaTek Unveils Dimensity 9400 Plus: Revolutionizing Flagship Phones with Advanced Edge-AI
Discover MediaTek's Dimensity 9400 Plus, offering a 20% Gen AI boost and cutting-edge edge-AI capabilities for future flagship smartphones.
Xiaomi and Qualcomm Forge 15-Year Strategic Alliance to Drive Next-Gen Smartphone Innovation
Xiaomi and Qualcomm have inked a 15-year partnership extension, ensuring Xiaomi's premium smartphones will lead with Snapdragon 8 series chips for years to come.