Revolutionary 1mm 'Fan on a Chip' Brings Active Cooling to Ultra-Thin Devices

Imagine a world where ultra-thin gadgets can stay cool without bulky fans or moving parts. xMEMS is making this a reality with their innovative XMC-2400 µCooling chip. This groundbreaking 'fan on a chip' technology leverages the benefits of solid-state speaker drivers, known for their extreme thinness and reliability, to provide active cooling solutions. At just 1mm thick, this microcooling chip is designed to integrate seamlessly into the slimmest of devices, ensuring they remain cool and efficient without compromising on design or performance. The XMC-2400 µCooling chip represents a significant leap forward in cooling technology, promising to enhance the functionality and longevity of next-generation electronics. Read the source »